Gigabyte switches RTX 5070 Ti Windforce V2 to thermal pads, ditching problematic gel

Gigabyte Revises Graphics Card Cooling Strategy: RTX 5070 Ti Windforce V2 Ditches Thermal Gel for Pads

Gigabyte, a prominent name in the PC hardware industry, appears to be stepping away from its controversial "server-grade thermal conductive gel" for its latest graphics card iteration. The RTX 5070 Ti Windforce V2 has been spotted sporting traditional thermal pads, a departure from the gel-based cooling solution implemented in some earlier models. This subtle yet significant shift was first brought to light by hardware analysts at Uniko Hardware on the X platform, who noticed the omission of any mention of thermal gel in the product descriptions of the refreshed Windforce model.

The Gel Experiment: Promises and Pitfalls

Following the launch of its RTX 50 series, Gigabyte began equipping many of its graphics cards with this novel "server-grade thermal conductive gel" in lieu of conventional thermal pads for cooling memory chips and MOSFETs. The company touted this material as a superior alternative, promising enhanced durability, more uniform surface contact, and improved thermal transfer capabilities compared to its predecessors. It was a bold move, aiming to redefine GPU thermal management.

However, the early rollout of this technology was not without its teething problems. By the beginning of the year, a considerable number of users began reporting instances of thermal gel leakage. This issue seemed particularly prevalent in systems where graphics cards were mounted vertically, a popular aesthetic choice for many PC builders. In some alarming cases, the gel had migrated so extensively that it barely remained on the memory chips, raising serious concerns about potential VRAM overheating and, consequently, hardware damage. One documented case saw a user replace the problematic gel with standard thermal pads, resulting in an impressive 7°C drop in temperatures, illustrating the practical impact of the gel's performance.

Gigabyte's Response and the Return to Tradition

Gigabyte did acknowledge the initial complaints, attributing the leakage to an excessive amount of gel applied during manufacturing. The company initially maintained that the problem was purely cosmetic and did not affect the operational integrity of the graphics cards. Simultaneously, they implemented measures to reduce the quantity of gel used in subsequent production runs. Thankfully, thus far, there have been no confirmed reports of graphics cards being permanently damaged due to the thermal gel issue. Nevertheless, Gigabyte remained tight-lipped about scenarios where the gel completely disappeared from critical components.

Regardless of the underlying reasons or the precise nature of the issue, owners of the new RTX 5070 Ti Windforce V2 can breathe a sigh of relief. Gigabyte has seemingly opted to revert to the tried-and-true method of employing classic thermal pads for its cooling needs. Whether this decision stems from a reassessment of reliability concerns or a strategic move to optimize production costs remains unconfirmed by the company.

Beyond Cooling: A More Compact Design

The revisions to the RTX 5070 Ti Windforce V2 extend beyond its thermal solution. Gigabyte has also undertaken a redesign of the card's physical construction, resulting in a more compact form factor. This new iteration is a remarkable 43mm shorter than the previously released RTX 5070 Ti Windforce SFF model. To accommodate this reduced size, the company has incorporated 80mm diameter fans. Furthermore, Gigabyte has altered the mounting hole configuration on the back of the PCB around the GPU area and has removed the dual-BIOS support, suggesting a focus on streamlining the card's design and features for a broader appeal.